The EtherCAT Technology Group has partnered with industry leaders to create a Specific Device Profile for Semiconductor Abatement and Sub Fab Systems termed ETG.5003.2000. These systems primarily deal with the exhaust gas handling and treatment from the semiconductor manufacturing process. An abatement device is usually comprised of numerous inlets feeding into a single common treatment system.
ETG.5003.2000 is the Specific Device Profile for Abatement and Sub Fab Systems and describes the network visible component of a semiconductor device of type Abatement and Sub Fab Systems. These systems primarily deal with the exhaust gas handling and treatment from the semiconductor manufacturing process. An abatement device is usually comprised of numerous inlets feeding into a single common treatment system. The Sub Fab system interface allows for additional semiconductor devices to be incorporated such as Roughing Pumps (ETG.5003.2050) or Turbo Pumps (ETG.5003.2070).
You will need to start with finding an EtherCAT slave controller and EtherCAT slave software stack to implement general EtherCAT communication. Then you can begin building out the CDP and SDP. Implementation of this SDP must be done in conjunction with the CDP as much of the SDP is based on CDP specifications. Most of this SDP pertains to software requirements specifically for the devices object dictionary and PDO mapping. Implementation of this SDP requires detailed knowledge of the SDP specification and your device's application.
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HMS offers hardware, software, and development services throughout each step in this process. HMS's experience and expertise in industrial communications can be leveraged to develop some or all of your SDP and CDP. See the chart below to review how HMS can help through the full ETG.5003 development process:
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How do I make my device Semiconductor conformant? Discover the easy steps in this Semiconductor EtherCAT Device Development Journey Infographic
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